ULTRA HIGH-PURITY TO MEET YOUR NEEDS
We produce the broadest range of Ultra High-Purity (UHP) chemistries focusing on the Electronics Industry. We’ve established a wide base of application specific products for the semiconductor industry.
STRAIGHT ACIDS AND BASES
These are the backbone of wet processes. As device geometries continue to shrink and efforts to reduce defect densities grow, so has the demand for ultra high-purity chemicals. With over 50 years of experience in the production and purification of these chemistries, we offer a suite of finished products with down to 10 part-per-trillion (ppt) impurities.
ETCHANT BLENDS
Etchant blends selectively and uniformly remove substrates without damaging underlying layers, critical to wafer manufacturing. Our Etchant Blending expertise ranges from mainstream etchants to the development and manufacture of unique blends for customer-specific applications. These blends benefit from the high-purity levels of our base products.
SOLVENTS
Solvents and solvent blends are used extensively throughout the semiconductor industry for cleaning equipment, drying wafers and substrate deposition or removal. We have a large portfolio of high-purity solvents to address the needs of the electronics market.
CLEANING CHEMISTRIES
Cleaning chemistries are critical for reducing defect densities and improving yields. Our innovations in cleaning mixtures have created new blends that reduce cost of ownership, are more environmentally friendly and focus on new interconnect/dielectric materials. Whether repairing the wafer surface for a thermal process, deposition of a substrate or removal of residues from the preceding operation, HEC offers the reliability that your manufacturing process requires. Proprietary blends are available.
Grade SEMI Standard Device Geometry XLSI Relates to SEMI Grade 4 Recommended for 0.09 – 0.20 µm technologies Trace Metals < 0.1 ppb SLSI Relates to SEMI Grade 3 Recommended for 0.20 – 0.80 µm technologies Trace Metals < 1 ppb ULSI Relates to SEMI Grade 2 Recommended for 0.80 – 1.20 µm technologies Trace Metals < 10 ppb VLSI Relates to SEMI VLSI Recommended for 0.80 – 1.20 µm technologies Trace Metals < 50 ppb for most elements (chemistry dependent) SEMI/EG Relates to SEMI Grade 1 Recommended for > 1.20 µm technologies For standard applications and manufacturing of discrete devices.